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HOME > 제품소개 > 반도체&솔라셀
Plasma Etching l Plasma Deposition l Atomic Layer Deposition l Cluster Configuration l    
1
ICP-RIE SI 500
- Low damage etching
- High rate etching
- Dynamic temperature control
- PTSA ICP source
5223
2
Etchlab 200
- Cost-effective
- Upgradeable with ldadlock and turbo pump
- Up to 8 inch wafers and carriers
- SENTECH control sortware
5251
3
SI 591 compact
- RIE plasma etcher with small footprint
- Halogen and fluorine chemistry
- Loadlock
- up to 8 inch wafers
4931
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